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企业名称:芯原微电子(成都)有限公司

公司地址:成都市天府软件园C区10栋23楼

公司性质: 外资(欧美) 公司规模: 50-150人

A leading Silicon Platform as a Service Company

VeriSilicon Holdings Co., Ltd. is a Silicon Platform as a Service (SiPaaS™) company that provides IP-centric, platform based custom silicon solutions and end-to-end semiconductor turnkey services for a wide range of applications across a wide variety of end markets including mobile internet devices, datacenters, the Internet of Things (IoT), wearable electronics, smart homes, and automotive.

VeriSilicon's SiPaaS solutions shorten design cycle, enhance quality, and reduce risk. The breadth and flexibility of our SiPaaS solutions make it an attractive alternative for a variety of customer types, including both emerging and established semiconductor companies, Original Equipment Manufacturers (OEMs), Original Design Manufacturers (ODMs), and large Internet platform companies.

VeriSilicon's silicon platforms include licensable Vivante GPU cores and vision image processors, ZSP® (digital signal processor) based HD audio, HD voice, multi-band and multi-mode wireless platforms, Hantro HD video platforms, wearable electronics platforms, IoT platforms, mixed signal NUI (natural user interface) platforms for voice, motion and touch interface. VeriSilicon's custom silicon turnkey service encompasses design service that combines its technology solutions and value-added mixed signal IP portfolio targeted for a wide range of process technology nodes, including advanced nodes like 28nm and 22nm FD-SOI, FinFET and provide product engineering service for System on a Chip (SoC) as well as System in a Package (SiP).

Founded in 2001 and head-quartered in Shanghai, China, VeriSilicon has over 600 employees with six R&D centers (China, US and Finland) and nine sales offices worldwide. Over the last ten years,

VeriSilicon has received many awards including:

Ranked among the top 50 high technology and high growth companies in China for the fifth time running (Deloitte Technology Fast 50 China)

Placed among the top 500 high technology and high growth companies in Asia Pacific (Deloitte Technology Fast 500 Asia)

Selected as one of 'Zero2IPO-China Venture 50' companies for the three consecutive years

Named one of the Red Herring's 100 Private Companies of Asia

Selected as one of EE Times 60 Emerging Startups

领先的平台化芯片设计服务公司

芯原股份有限公司(芯原)是一家芯片设计平台即服务(Silicon Platform as a Service,SiPaaSTM)提供商,为包含移动互联设备、数据中心、物联网(IoT)、可穿戴设备、智能家居和汽车电子等多种终端市场在内的各种广泛应用提供以IP为中心的、基于平台的芯片定制服务和一站式端到端的半导体设计服务。

芯原的SiPaaS解决方案可缩短设计周期、提高产品质量和降低风险。宽泛和灵活的SiPaaS解决方案为包含新兴和成熟半导体厂商、原始设备制造商(OEMs)、原始设计制造商(ODMs),以及大型互联网平台提供商在内的各种客户类型提供极具吸引力的半导体产品替代解决方案。

芯原的芯片平台包括可授权的Vivante GPU核和视觉图像处理器,基于ZSP®(数字信号处理器核)的高清音频、高清语音平台和多频多模无线平台, Hantro高清视频平台,可穿戴设备平台,物联网(IoT)平台,面向语音、手势和触摸界面的混合信号自然用户界面(NUI)平台。芯原的一站式芯片定制服务所涵盖的内容包括:面向一系列宽泛的工艺制程节点(含28nm和22nm FD-SOI、FinFET等先进工艺节点),结合自身技术解决方案和增值的混合信号IP组合所提供的设计服务,以及为系统级芯片(SoC)和系统级封装(SiP)所提供的产品设计及工程服务。

芯原成立于2001年,总部位于中国上海,目前在全球已有超过600名员工。芯原在中国、美国和芬兰共设有6个设计研发中心,并在全球共设有9个销售和客户支持办事处。

公司成立十年来,已经获得了许多奖项:

连续五年入围德勤中国高科技、高成长50强 (Deloitte Technology Fast 50 China)

连续八年入围德勤亚太区高科技高成长500强 (Deloitte Technology Fast 500 Asia Pacific)

连续三年被提名为“清科-中国最具投资价值50强公司”

曾荣获 Red Herring 亚洲尚未上市企业100强企业 (Red Herring‘s 100 Private Companies of Asia) 称号

曾入选 EE Times 全球60家最具潜力半导体初创公司 (EE Times 60 Emerging Startups)

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